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LMG2610

ACTIVE

650-V 170/248-mΩ GaN half-bridge for ACF with integrated driver, protection and current sense

Product details

VDS (max) (V) 650 RDS(on) (mΩ) 170 ID (max) (A) 5.4 Features Bottom-side cooled, Built-in bootstrap diode, Cycle-by-cycle overcurrent protection, Half-bridge, Overtemperature protection, USB C/PD compatible
VDS (max) (V) 650 RDS(on) (mΩ) 170 ID (max) (A) 5.4 Features Bottom-side cooled, Built-in bootstrap diode, Cycle-by-cycle overcurrent protection, Half-bridge, Overtemperature protection, USB C/PD compatible
VQFN (RRG) 40 63 mm² 9 x 7
  • 650-V GaN power-FET half bridge
  • 170-mΩ low-side and 248-mΩ high-side GaN FETs
  • Integrated gate drivers with low propagation delays and adjustable turn-on slew-rate control
  • Current-sense emulation with high-bandwidth and high accuracy
  • Low-side / high-side gate-drive interlock
  • High-side gate-drive signal level shifter
  • Smart-switched bootstrap diode function
  • High-side start up : < 8 us
  • Low-side / high-side cycle-by-cycle over-current protection
  • Over-temperature protection with FLT pin reporting
  • AUX idle quiescent current: 240 µA
  • AUX standby quiescent current: 50 µA
  • BST idle quiescent current: 60 µA
  • Maximum supply and input logic pin voltage: 26 V
  • 9x7 mm QFN package with dual thermal pads
  • 650-V GaN power-FET half bridge
  • 170-mΩ low-side and 248-mΩ high-side GaN FETs
  • Integrated gate drivers with low propagation delays and adjustable turn-on slew-rate control
  • Current-sense emulation with high-bandwidth and high accuracy
  • Low-side / high-side gate-drive interlock
  • High-side gate-drive signal level shifter
  • Smart-switched bootstrap diode function
  • High-side start up : < 8 us
  • Low-side / high-side cycle-by-cycle over-current protection
  • Over-temperature protection with FLT pin reporting
  • AUX idle quiescent current: 240 µA
  • AUX standby quiescent current: 50 µA
  • BST idle quiescent current: 60 µA
  • Maximum supply and input logic pin voltage: 26 V
  • 9x7 mm QFN package with dual thermal pads

The LMG2610 is a 650-V GaN power-FET half bridge intended for < 75-W active-clamp flyback (ACF) converters in switch mode power supply applications. The LMG2610 simplifies design, reduces component count, and reduces board space by integrating half bridge power FETs, gate drivers, bootstrap diode, and high-side gate-drive level shifter in a 9-mm by 7-mm QFN package.

The asymmetric GaN FET resistances are optimized for ACF operating conditions. Programmable turn on slew rates provide EMI and ringing control. The low-side current-sense emulation reduces power dissipation compared to the traditional current-sense resistor and allows the low-side thermal pad to be connected to the cooling PCB power ground.

The high-side gate-drive signal level shifter eliminates noise and burst-mode power dissipation problems found with external solutions. The smart-switched GaN bootstrap FET has no diode forward-voltage drop, avoids overcharging the high-side supply, and has zero reverse-recovery charge.

The LMG2610 supports converter light-load efficiency requirements and burst-mode operation with low quiescent currents and fast start-up times. Protection features include FET turn-on interlock, under-voltage lockout (UVLO), cycle-by-cycle current limit, and over temperature shut down.

The LMG2610 is a 650-V GaN power-FET half bridge intended for < 75-W active-clamp flyback (ACF) converters in switch mode power supply applications. The LMG2610 simplifies design, reduces component count, and reduces board space by integrating half bridge power FETs, gate drivers, bootstrap diode, and high-side gate-drive level shifter in a 9-mm by 7-mm QFN package.

The asymmetric GaN FET resistances are optimized for ACF operating conditions. Programmable turn on slew rates provide EMI and ringing control. The low-side current-sense emulation reduces power dissipation compared to the traditional current-sense resistor and allows the low-side thermal pad to be connected to the cooling PCB power ground.

The high-side gate-drive signal level shifter eliminates noise and burst-mode power dissipation problems found with external solutions. The smart-switched GaN bootstrap FET has no diode forward-voltage drop, avoids overcharging the high-side supply, and has zero reverse-recovery charge.

The LMG2610 supports converter light-load efficiency requirements and burst-mode operation with low quiescent currents and fast start-up times. Protection features include FET turn-on interlock, under-voltage lockout (UVLO), cycle-by-cycle current limit, and over temperature shut down.

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* Data sheet LMG2610 Integrated 650-V GaN Half Bridge for Active-Clamp Flyback Converters datasheet (Rev. A) PDF | HTML 12 Dec 2022
Application note Enabling Small-Form-Factor AC/DC Adapters With use of Integrated GaN Technology PDF | HTML 27 Mar 2023
EVM User's guide Using the UCC28782EVM-030 (Rev. C) PDF | HTML 28 Jul 2022

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